摘要
介绍了印制板组件上耐高温插装元件的通孔回流焊接工艺技术。通过焊膏印刷模板开口设计优化、焊膏印刷模板厚度设计优化、焊膏印刷参数优化、预成型焊片的焊膏量补偿工艺以及回流焊接工艺参数优化,在厚度较厚的印制板组件上形成的插装元件焊点形态良好,焊料润湿所有焊接面,形成良好的锡焊轮廓线,孔内焊料结晶组织均匀,填充率达到100%,焊接质量良好。
It was introduced that the pin-through-hole reflow soldering process technology of printed circuit board assembly.Through the optimization of solder paste printing template opening design,solder paste printing template thickness design,solder paste printing parameters,solder paste compensation process for preformed solder chips and reflow soldering process parameters,a good solder joint shape of plug-in components was formed on the thick printed circuit board assembly.The solder moistened all the welding surfaces to form a good solder contour.The crystal structure of the solder in the hole was uniform,the filling rate reached 100%,and the soldering quality was perfect.
作者
杨小健
沈丽
祝蕾
张琪
YANG Xiaojian;SHEN Li;ZHU Lei;ZHANG Qi(Beijing Institute of Computer Technology and Application,Beijing 100854,China)
出处
《新技术新工艺》
2020年第3期8-13,共6页
New Technology & New Process
关键词
通孔回流焊接
模板
预成型焊片
工艺优化
pin-through-hole reflow soldering
template
preformed solder chips
process optimization