耐高温插装元件通孔回流焊接工艺优化

Optimization of Pin-through-hole Reflow Soldering Process for High Temperature Resistant Plug-in Components

介绍了印制板组件上耐高温插装元件的通孔回流焊接工艺技术。通过焊膏印刷模板开口设计优化、焊膏印刷模板厚度设计优化、焊膏印刷参数优化、预成型焊片的焊膏量补偿工艺以及回流焊接工艺参数优化,在厚度较厚的印制板组件上形成的插装元件焊点形态良好,焊料润湿所有焊接面,形成良好的锡焊轮廓线,孔内焊料结晶组织均匀,填充率达到100%,焊接质量良好。

It was introduced that the pin-through-hole reflow soldering process technology of printed circuit board assembly.Through the optimization of solder paste printing template opening design,solder paste printing template thickness design,solder paste printing parameters,solder paste compensation process for preformed solder chips and reflow soldering process parameters,a good solder joint shape of plug-in components was formed on the thick printed circuit board assembly.The solder moistened all the welding surfaces to form a good solder contour.The crystal structure of the solder in the hole was uniform,the filling rate reached 100%,and the soldering quality was perfect.