低银无镉Ag-Cu-Zn钎料的合金化改性

Alloying modification of low silver and cadmium-free Ag-Cu-Zn solder

介绍了低银无镉Ag-Cu-Zn系钎料的成分特点和研发思路,采用Sn、P元素对含银21 mass%的Ag-Cu-Zn系钎料进行合金化,讨论了Sn、P元素含量对钎料熔化温度及显微组织的影响。结果表明,随Sn含量增加,钎料的熔化温度可持续下降,同时晶内及晶界相的Sn固溶量增大,钎料趋于硬脆。微量P的添加能显著降低银钎料的熔点,(Sn+P)低水平复合添加可在满足熔化特性的同时,避免由于过量Sn固溶导致的加工成型困难,有利于钎料的实用生产。

The composition characteristics and research and development routes of low silver and cadmium-free Ag-Cu-Zn solders were introduced. The Ag-Cu-Zn solder containing 21 mass% silver was alloyed with Sn and P elements, and the effect of Sn and P element contents on melting temperature and microstructure of the solders was discussed. The results show that with the increase of Sn content, the melting temperature of the solders decreases continuously, and the amount of Sn solid solution in intra-granular and grain boundary phase increases, and the solder tends to be hard and brittle. The addition of trace P can significantly reduce the melting point of the silver solder. The low level addition of(Sn+P) can not only meet the melting characteristics, but also avoid the processing difficulties caused by excessive Sn solution, which is beneficial to the practical production of the solder.