覆铜板增强基材对位芳纶纸的制备与性能研究

Preparation and Properties of Para-Armid Paper for Cppper Clad Laminate Reinforced Substrate

用对位芳纶短切纤维和对位芳纶沉析纤维制造对位芳纶纸,用扫描电镜对纸面和横断面进行了观察,并测试其基本性能、电性能和热性能;将样品交由客户进行覆铜板制作并进行验证测试。结果表明:国产对位芳纶纸具有良好的浸漆性、力学性能和热性能,而且介电常数与介质损耗因数很低,满足覆铜板应用需求。

The para-aramid paper was made from para-aramid chopped fibers and para-aramid fibrids. Its surface and cross-section were observed by electron microscopy, and the basic properties, electrical properties and thermal properties were tested. The customer performs the copper clad laminate production and performs verification tests. The results show that the domestic para-aramid paper has good varnish,mechanical properties and thermal properties, and the dielectric constant and dielectric loss factor are very low, which can meet the application requirements of copper clad laminates.