热阻仿真在陶瓷封装电阻计算中的应用

Application of Thermal Resistance Simulation in the Calculation of the Ceramic Packaging Resistance

随着半导体封装器件的不断发展,工作电流不断增加,对陶瓷封装的电性能提出了更高要求,而导通电阻是衡量其电性能最重要的参数之一,会影响电路的稳定性和功耗波动。提出了一种陶瓷封装中导通电阻仿真求解的新方法,利用ANSYS软件热阻仿真模型等效求解电阻的方式,实现导通电阻值的精确计算。阐述了热阻模型与电阻模型的等效机理,对比了传统估值法与仿真求解法的计算结果,结果表明,仿真求解法得到的电阻值与实测电阻值更为接近,误差小于5%,而传统估值法误差最高可达30%。仿真求解法计算时间大大缩短,效率更高,还可观察线路的连通关系,错误率远低于传统估值算法。该方法适用于陶瓷封装中不同类型和任意结构的阻值计算,通用性强。

With the continuous development of packaged semiconductor devices and the increase of the operating current,higher requirements for the electrical performance of the ceramic packaging are put forward.On-resistance is one of the most important parameters for measuring the electrical performance of devices and affects the circuit stability and power dissipation fluctuation.A new method for on-resistance simulation in ceramic packaging was proposed.The thermal resistance simulation model of ANSYS software was used to solve the resistance equivalently,and the accurate calculation of the on-resistance value was realized.The equivalent mechanisms of the thermal resistance model and the resistance model were presented,and the calculation results of the conventional estimation method and simulation method were compared.The results show that the resistance value obtained by the simulation method is closer to the measured value.The error is less than 5%,while the maximum error of the conventional estimation method is up to 30%.The calculation time of the simulation method is greatly shortened and the efficiency is higher.Besides,the line connection can also be observed.The error rate is much lower than that of the conventional estimation method.It is suitable for calculating the resistance of different types and arbitrary structures in ceramic packaging,and has a strong universality.