摘要
聚酰亚胺(PI)由于具有优异的热稳定性和尺寸稳定性等性能,被认为是柔性有机电致发光器件(FOLED)衬底和封装材料的最佳选择之一。但PI材料的阻隔性能达不到FOLED封装的要求,这限制了其作为FOLED衬底和封装材料的应用。介绍了高阻隔聚酰亚胺的研究现状,并对未来高阻隔聚酰亚胺在柔性显示中的应用进行展望。
Polyimides(PIs) are considered as one of the best candidates for flexible organic electroluminescent device( FOLED) substrates and packaging materials due to their excellent thermal stability and dimensional steadiness. However, the barrier properties of PI materials can not meet the requirements of FOLED packages, which hinders their use in application of FOLED substrates and packaging materials.This paper reviews the research progress of high barrier polyimides and prospects the future development of high barrier polyimides in flexible display.
作者
唐傲
谭井华
刘亦武
Tang Ao;Tan Jinghua;Liu Yiwu(School of Packaging and Materials Engineering,Hunan University of Technology,Hunan Zhuzhou 412007)
出处
《云南化工》
CAS
2020年第3期19-21,共3页
Yunnan Chemical Technology
关键词
聚酰亚胺
阻隔技术
阻隔性能
polyimide
barrier technology
barrier properties
