新的环保型PCB金属化孔技术——石墨烯金属化孔工艺和失效模式分析

New technology of PCB metallization holes with environmental protection——Graphene metallization hole process and failure model effectiveness analysis

文章综述PCB传统化学沉铜工艺存在的问题,石墨烯金属化工艺的优良特性和技术亮点,石墨烯金属化原理,及与黑孔工艺的区别,石墨烯的核心性能,石墨烯金属化工艺流程,本工艺的检测方法,石墨烯金属化工艺失效模式分析。预测了石墨烯金属化取代传统的化学沉铜和黑孔工艺发展方向。

This paper summarizes the problems of traditional PTH process for PCB,the excellent characteristics and technical highlights of graphene metallization process,the principle of graphene metallization,the difference with black hole process,the core performance of graphene,the process flow of graphene metallization,the detection method of this process,and the failure mode analysis of graphene metallization process.It is predicted that graphene metallization will replace the traditional PTH process and black hole process.