老化过程对PCB材料电性能的影响研究

Study on the Influence of Resin-based composite electrical performance during aging

为研究印制电路板(PCB)材料在各种不同老化条件下对传输线的信号完整性的影响,通过对PCB材料进行了长时间烘烤、高低温渐变、高温高湿、自然室外环境以及冰冻等条件下进行老化并对老化前后材料的玻璃化转变温度与电学性能进行研究。结果表明,长时间老化会使材料的介电常数与损耗因子有不同程度的恶化对传输线进行测试发现,由于玻璃布能够阻挡老化且传输线周围的树脂受到环境老化的影响有限。长时间的高温烘烤能使材料中的树脂固化更加充分,最后导致插入损耗反而能够提升,其他老化对传输线的插入损耗会略微下降。同时本文也提供了提升PCB插入损耗的新思路。

In order to study the influence of resin-based composite materials on electrical properties of transmission lines under various aging conditions,the materials for printed circuit boards were baked for a long time,with high and low temperature gradient,high temperature and high humidity,and natural outdoor.The aging was carried out under the environment and under freezing conditions,and the Tg temperature and electrical properties of the materials before and after aging were also studied.The results show that the aging of the material will deteriorate the Tg temperature,dielectric constant and loss factor of the material to varying degrees.The test of the transmission line before and after aging found that the glass cloth could block the aging and the resin around the transmission line was limited by the environmental aging.The insertion loss will decrease slightly,and the high temperature baking can make the moisture in the material and make the resin in the process more solidified.Finally,the insertion loss can be improved.This paper also provides a new idea to improve the insertion loss of the printed circuit board.