摘要
随着焊接工艺从有铅向无铅转换,焊接温度的提高,使PCB在焊接过程发生分层的风险加大。造成PCB分层的因素很多,文章通过一款产品的分层失效案例,来表述失效分析过程使用的方法和仪器设备。
As the soldering technology switches from leaded to lead-free,the soldering temperature is increased,which increases the risk of PCB getting delaminated during the soldering.Many factors attribute to the PCB delamination.This paper describes the methods and equipment used in the failure analysis process through a case of delamination failure of certain products.
出处
《印制电路信息》
2020年第3期56-59,共4页
Printed Circuit Information
