高温下熔融SnAgCu-xTi在SiO2表面的润湿行为

Wetting Behavior of Molten SnAgCu-xTi on SiO2 Surface Under High Temperature

采用改良座滴法研究了高真空、800~900℃条件下熔融Sn0.3Ag0.7Cu(SAC)-x Ti(x=0%、1%、3%,质量分数)在SiO 2表面的润湿行为。研究结果表明:在SAC中添加少量的Ti后,可以显著提高SAC在SiO 2表面的润湿性。当Ti浓度为3%时,Ti未被完全溶解,这是因为随着Ti浓度的增加,在Ti表面会形成一层高熔点的Sn-Ti金属间化合物,进而阻碍Ti的进一步溶解。液固界面反应产物为Ti 5Si 3和TiO,铺展动力学可用反应产物控制模型描述;在铺展过程中,快速铺展阶段首先析出Ti 5Si 3和TiO,线性铺展阶段仅析出TiO。该体系的最终润湿性取决于界面反应产物和界面上Ti-O吸附的共同作用。

The wetting of SiO 2 by molten Sn0.3Ag0.7Cu(SAC)-x Ti(x=0wt%,1wt%,3wt%)was studied by using the modified sessile drop method at 800-900℃under a high vacuum.The small addition of Ti into SAC alloy can improve wettability,significantly.Because the Sn-Ti intermetallics with high melting point covered Ti addition and blocked further dissolution of Ti,and thus Ti cannot be dissolved completely when the nominal concentration of Ti was 3wt%.The reaction products at liquid/solid interface are Ti 5Si 3 and TiO.The spreading dynamics can be described by reaction product control model.The spreading may be coupled firstly with the precipitation of Ti 5Si 3 and TiO together meanwhile be affected by the dissolution of Ti addition,and then the precipitation of TiO alone.The final wettability was determined both by the wetting character of reaction products and also Ti-O adsorption at interface.