Ag-Au-Cu合金表面张力的理论计算

Theoretical calculation of surface tension of Ag-Au-Cu alloy

表面张力对于材料而言是一种关键性的性质,该性能在液态金属和合金的成分设计领域有着十分重要的地位,其对铸造以及键合丝键合时金属凝固过程中表面是否开裂、焊接后焊接处的微观形貌有着决定性的影响。使用Butler模型和Toop模型分别计算金银铜及其对应二元合金在熔融状态下的表面张力并与实验值进行对比,从而为金银键合丝的成分设计起到一定的指导作用。结果表明:采用Butler模型和Toop模型计算出二元以及三元合金的表面张力与实验值相差较小。在1381K下,Ag-Au-Cu三元合金表面张力随Au和Cu含量变化介于0.89392~1.32471 N/m之间,表面张力随Ag或者Cu含量增加呈现单调减小或单调增大的趋势。

The surface tension is a key property for materials.This property plays an important role in the field of composition design of liquid metals and alloys.It plays a decisive role in the surface cracking during solidification and the micro-morphology of welded joints after welding.The Butler model and Toop model were used to calculate the surface tension of Au,Ag,Cu and their corresponding binary alloys in melting state,respectively,and the results were compared with the experimental values,so as to play a guiding role in the composition design of Au-Ag bonding wires.The results show that the surface tensions of binary and ternary alloys are calculated by Butler model and Toop model,which differs little from the experimental values.The surface tensions of Ag-Au-Cu ternary alloy vary from 0.89392 N/m to 1.32471 N/m with the change of Au and Cu content at 1381 K.The surface tensions decrease or increases monotonously with the increases of Ag or Cu content.