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无机填料对环氧树脂胶粘剂的粘接性能的影响 被引量:8

Effect of Inorganic Fillers on the Bonding Property of Epoxy Resin Adhesive
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摘要 选取了硅微粉、Al2O3、莫来石、氮化硼、滑石粉、云母、SiO2等无机填料作为改性环氧树脂胶粘剂的组分,讨论了不同类别的填料及用量对改性环氧树脂粘接强度和粘接界面的影响.每种无机填料对于粘接强度均有不同程度的提高,粘接强度随着填料用量的增加呈现先提高后降低的趋势,其中15份Al2O3的提高效果最佳,剪切强度和剥离强度分别可以达到22.42MPa和12.84N/cm. Some inorganic fillers,such as microsilica,A12O3,mullite,boron nitride,talcum powder,mica and SiO2 are selected as the components of modified epoxy resin adhesive.The effects of different kinds of fillers and their dosage on the bonding strength and interface of modified epoxy resin are discussed.These inorganic fillers have different degrees of improvement on the bonding strength of modified epoxy resin.The bonding strength firstly increases and then decreases along with the increasing of the amount of fillers.Among these fillers,15 parts of A12O3 have the best effect on the improvement,and the shear strength and peel strength can reach 22.42MPa and 12.84N/cm respectively.
作者 陈泽明 宁志强 曹先启 李博弘 贾晓莹 李永河 王超 CHEN Ze-ming;NING Zhi-qiang;CAO Xian-qi;LI Bo-hong;JI A Xiao-ying;LI Yong-he;WANG Chao(.Institute of Petrochemistry,Heilongjiang A cademy of Science,Harbin 150040,China;Institute of Advanced Technology,Heilongjiang A cade my of Sciences,Harbin 150020,China)
出处 《化学与粘合》 CAS 2020年第2期96-98,119,共4页 Chemistry and Adhesion
关键词 无机填料 环氧树脂 粘接强度 Inorganic fillers epoxy resin bonding strength
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