改性环氧丙烯酸胶的制备及其电阻稳定性的研究

Preparation of Modified Epoxy Acrylic Adhesive and Study on Its Resistance Stability

以环氧丙烯酸树脂作为基体,用片状和球状银包铜粉作为导电填料进行树脂填充,无水乙醇作为溶剂、邻苯二甲酸二丁酯(DBP)作为增韧剂、二乙烯三胺和三乙烯四胺作为固化剂来制备银包铜粉改性环氧丙烯酸胶粘剂.通过对固化剂掺入量、固化剂的类别、银包铜粉的种类的改变,研究导电胶粘剂的体积电阻率的变化,从中取得制备电阻率最低的导电胶配方.

The epoxy acrylic resin is used as the matrix,and the resin is filled with conductive fillers which are flake and spherical silver-coated copper powders.The silver-coated copper powder modified epoxy acrylic adhesive is prepared with the absolute ethanol as solvent,the dibutyl phthalate(DBP)as toughening agent,the diethylenetriamine and triethylenetetramine as curing agents.The effects of amount of curing agent,the type of curing agent and silver-coated copper powder on the volume resistivity of conductive adhesive is studied,and the formulation of conductive adhesive with the lowest resistivity is obtained.