热固性酚醛树脂移印标识牢固性研究

Study on Marking Firmness of Transfer Printing and Marking

镀金盖板广泛应用于军品集成电路的气密性封装中,表面标识通常采用油墨移印方式进行打标。移印打标后的电路在经历表贴后易出现标识脱落的问题,导致用户无法辨认。通过研究移印打标过程中采用的热固性酚醛树脂油墨固化机理,确定了电路经历异常高温、助焊剂污染、清洗剂清洗及外力摩擦与标识牢固性的关系,有效指导了表贴厂家在后续表贴时的注意事项。

Gold-plated cover plates are widely used in air-tight packaging of military integrated circuits.Surface marking is usually marked by ink pad printing.However,after the circuit is marked by pad printing,the problem that the logo is apt to fall off after the surface is pasted causes the user to fail to recognize it.By studying the curing mechanism of the thermosetting phenolic resin ink used in the pad printing process,the relationship between the circuit experiencing abnormal high temperature,flux contamination,cleaning agent cleaning and external friction and the firmness of the logo was determined,which effectively guided the surface mount manufacturers in precautions for subsequent surface mount.