烧结温度对钼铜合金组织和性能的影响

EFFECT OF SINTERING TEMPERATURE ON MICROSTRUCTURE AND PROPERTIES OF MOLYBDENUM-COPPER ALLOY

钼铜合金因具有良好的高温强度、硬度以及优异的导电性能,作为功能材料被广泛应用于集成电路、电子封装材料、传感器等电子器件,对于提高钼合金综合性能起到重要作用。本文以钼粉和铜粉为原料,通过粉末冶金方法制备钼铜合金材料,利用扫描电镜(SEM)和X射线衍射(XRD)等方法,研究了不同烧结温度对钼铜合金组织、成分均匀性和性能的影响。实验结果表明,在1050~1350℃烧结即可实现合金快速强化。结合XRD可知,较高的烧结温度虽然会造成微量的Cu损耗,但是渗Cu现象完全得以控制。严格控制烧结温度在1550~1650℃之间,既可保证合金内的Cu含量,也可保证Cu在Mo晶粒间的粘结作用达到最佳状态,从而获得相比低温烧结时成分更为均匀,密度、硬度、抗拉强度、电学等综合性能均达到最佳的钼铜合金材料。

Molybdenum-copper alloy has good high temperature strength,hardness and excellent electrical conductivity.As functional material,it is widely used in electronic devices such as integrated circuit,electronic packaging materials,sensors and so on.It plays an important role in improving the comprehensive performance of molybdenum alloy.In this study,molybdenum copper alloy was prepared by powder metallurgy method with molybdenum and copper powders as raw materials.The effect of different sintering temperatures on microstructure,composition uniformity and properties of molybdenum-copper alloys was studied by means of Scanning Electron Microscopy(SEM)and X-Ray Diffraction(XRD).It shows from the experimental results that rapid sintering of the alloy can be achieved by sintering at 1050~1350℃.Combined with XRD,although the higher sintering temperature will cause a small amount of Cu loss,the phenomenon of Cu infiltration is completely controlled.Strictly controlling the sintering temperature between 1550℃and 1650℃,it can ensure Cu content in the alloy,and also to ensure that the bonding effect of Cu between Mo grains reaches the optimal state.In this way,compared with low temperature sintering,the composition is more uniform,and the comprehensive properties such as density,hardness,tensile strength and electrical properties have reached the best rank.