高密度核级安全系统印制线路板组件三防涂覆性能的工艺研究及验证

Process Research and Verification of Three Anti-Coatings Performance for High Density Nuclear Safety System Printed Circuit Board Assembly

核级安全系统电子产品作为3级高性能电子产品服务不可间断,且最终产品使用环境异常苛刻,三防涂覆作为印制线路板组件的“防护层”是确保印制线路板应对苛刻环境、延长其寿命、确保功能的最有效手段之一。以核级电子产品印制线路板组件为研究对象,选用了不同类型的4种三防漆,通过对比分析其理化特性、附着力、漆膜厚度,以及涂覆后应对湿热试验、霉菌试验、盐雾试验能力的比对分析,选出了一种最适合核级电子产品的三防清漆。

As a Class 3 high-performance electronic product,nuclear-grade electronic products require the service of such products to be uninterrupted.Moreover,the final product is in an extremely harsh environment.As the"protective layer"of printed circuit board assemblies,three anti-coatings is one of the most effective means to ensure that printed circuit board can cope with harsh environment,prolong its life and ensure its functions.In this paper,the printed circuit board assemblies of nuclear-grade electronic products are studied,four different kinds of three anti-paints were selected,comparing and analyzing their physical and chemical properties,adhesion,paint film thickness,as well as the comparison analysis of the ability to deal with the wet and heat test,mould test and salt spray test after being coated,a kind of three anti-corrosion varnish which was most suitable for nuclear grade electronic products was selected.