期刊文献+

螺旋线镀金薄膜磁控溅射设备的研制

Development of a Magnetron Sputtering Equipment for Helix Gold-Coating
下载PDF
导出
摘要 本文详细介绍了用于螺旋线镀金薄膜的磁控溅射设备的研制过程。首先明确了该设备的研制难点,其次对设备的主要组成部分进行了详细的说明,针对设备的几个研制难点提出了解决方案,最后利用研制好的设备进行了膜厚均匀性分析实验。实验表明膜层均匀性良好,达到了预期要求,客户反馈良好。 In this paper, the development process of a magnetron sputtering equipment for helix gold-coating is described in detail. First the difficulties in the development are clarified, then the main components of the equipment are described in detail and the corresponding solutions for the difficulties are proposed, and finally the thickness uniformity analysis of the film made by this equipment is carried out. The analysis result shows that the film has good uniformity and can meet the expected requirement. The customer is satisfied with the equipment.
作者 张吉峰 韩永超 唐榕 宋艳鹏 ZHANG Ji-feng;HAN Yong-chao;TANG Rong;SONG Yan-peng(Beijing Vacuum Electronics Research Institute,Beijing 100015,China)
出处 《真空电子技术》 2020年第2期48-50,63,共4页 Vacuum Electronics
关键词 螺旋线 金薄膜 磁控溅射设备 Helix Gold film Magnetron sputtering equipment
  • 相关文献

参考文献4

二级参考文献39

  • 1章志敏,刘德斌,杨向东,邱龙会,付志兵,余斌.超细钼丝亚硫酸盐脉冲镀金实验研究[J].强激光与粒子束,2005,17(7):1027-1030. 被引量:8
  • 2朱兆君,贾宝富,罗正祥.螺旋慢波电路参数变化对行波管特性的影响[J].真空科学与技术学报,2006,26(1):23-27. 被引量:16
  • 3Rocci J. Thermal-structural reliability assessment of helix TWT interaction circuit using finite element analysis. Aerospace and Electronics Conference, New York, 1993: 731-737.
  • 4Sauseng O, and Manoly A E, et al.. Thermal properties and power capability of helix structures for millimeter waves. International Electron Devices Meeting, New York, 1978:534 -537.
  • 5Crivello R, et al.. Thermal analysis of PPM-focused rod-supported TWT helix structures. IEEE Trans. on Electron Devices, 1988, 35(10): 1701-1720.
  • 6Verma L S, Shrotriya S, and Chaudhary D. Thermal conduction in two-phase materials with spherical and non-spherical inclusions. J. Physics D, 1991, 24(5): 1729-1737.
  • 7Springer G S and Tsai S W. Thermal conductivities of unidirectional materials. J. Comp. Materials, 1967, 1(3): 166-173.
  • 8Kunkel S H and Peck W M. Predicting thermal contact resistance in circuit card assemblies. InterSociety Conference on Thermal Phenomena, Texas, 1994: 91-100.
  • 9Joe X.Qiu,David K.Abe,Thomas M.Antonsen,et al.Traveling -wave tube amplifier performance evaluation and design optimization for applications in digital communications with multilevel modulations. IEEE Trans.on ED . 2003
  • 10Han Yong,Liu Yanwen,Ding Yaogen,et al.Thermal analysis of a helix TWT slow-wave structure. IEEE Trans.on ED . 2008

共引文献11

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部