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均热板散热器的传热特性实验研究 被引量:1

Experimental Investigation of Performance for Vapor Chamber Heat Sinks
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摘要 为了研究通信设备不同应用场景中散热器传热性能,设计了内嵌均热板散热器、复合芯均热板散热器和金属丝网吸热芯均热板散热器3种不同类型的散热器,针对不同风速、不同放置方向(重力因素)对3种均热板散热器的传热性能进行了实验研究。实验结果表明,在不考虑重力因素的情况下,复合芯均热板散热器具有较好的传热性能,而放置方向(重力因素)对复合芯均热板散热器和单一粉末烧结吸热芯均热板散热器的传热性能影响较大,在散热器设计选型时需要重点考虑均热板散热器的实际应用场景。 In order to study the heat transfer performance of heat sink in different application scenarios of communication equipment,three different types of heat sinks are designed,that is the heat sink with vapor chamber strip base,heat sink with composite wick vapor chamber base and heat sink with wiremesh vapor chamber base.The heat dissipation performance of three kinds of vapor chamber heat sink are studied in different wind speed and different orientations(gravity factor).The experimental results show that,without considering the gravity factor,heat sink with composite wick vapor chamber base has better heat dissipation performance,while the orientation(gravity factor)has a great influence on the heat dissipation performance of heat sink with vapor chamber strip base and heat sink with wiremesh vapor chamber base,so it is necessary to focus on the actual application scenarios of the vapor chamber heat sink in the heat sink design and selection.
作者 杨明冬 宋蓓莉 全本庆 马卫东 姜展翔 YANG Mingdong;SONG Beili;QUAN Benqing;MA Weidong;JIANG Zhanxiang(Accelink Technologies Co.,Ltd., Wuhan 430205,China)
出处 《机械与电子》 2020年第4期3-5,10,共4页 Machinery & Electronics
基金 国家重点研发计划资助项目(2018YFB2201601)。
关键词 均热板 散热 热设计 散热实验 vapor chamber heat dissipation thermal design heat dissipation test
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  • 1唐琼辉,徐进良,李银惠,刘小龙.一种新型微热管传热性能的实验研究[J].热能动力工程,2006,21(4):350-354. 被引量:15
  • 2吕永超,杨双根.电子设备热分析、热设计及热测试技术综述及最新进展[J].电子机械工程,2007,23(1):5-10. 被引量:73
  • 3张亚平,余小玲,周恩民,冯全科.新型径向平板热管传热性能的实验研究[J].西安交通大学学报,2007,41(7):780-783. 被引量:4
  • 4Sobhan C B, Garimella S V, Unnikrishnan V V. A computational model for the transient analysis of flat heat pipe [ C ] //Thermo Mechanical Phenomena in Electronic Systems Proceedings of the Intersociety Conference. 2000, 2: 106-113.
  • 5Vadakkan U, Murthy J Y, Garimella S V. Transient analysis of fiat heat pipes[ C ] //Proceedings of the 2003 ASME Summer Heat Transfer Conference. HT2003-47349, Las Vegas, NV ,2003 : 1 - 11.
  • 6Carbajal G, Sobhan C B, Peterson G P, et al. Thermal response of a flat heat pipe sandwich structure to a localized heat flux [ J]. International Journal of Heat and Mass Transfer, 2006, 49: 4070-4081.
  • 7Carbajal G, Sobhan C B, Peterson G P, et al. A quasi-3D analysis of the thermal performance of a flat heat pipe[ J]. International Journal of Heat and Mass Transfer, 2007, 50 : 4286-4296.
  • 8Hsieh S, Leea R, Shyub J, et al. Analytical solution of thermal resistance of vapor chamber heat sink with and without pillar[ J]. Energy Conversion and Management, 2007, 48: 2708-2717.
  • 9Koito Y, Imura H, Mochizuki M, et al. Numerical analysis and experimental verification on thermal fluid phenomena in a vapor chamber [ J ]. Applied Thermal Engineering, 2006,26 : 1669-1676.
  • 10陈伟,罗小兵,程婷,黄素逸,刘胜.大功率LED用微喷射流冷却系统的实验研究[J].半导体光电,2007,28(4):478-481. 被引量:13

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