基于板方式器件级测试老炼的可行性研究

The Feasibility Study of the Device-level Testing and Burr-in Based on Board Mode

随着低成本卫星的快速发展,对商用器件的选用需求日益旺盛。针对一些复杂商用器件的质量保证工作,测试成为了工程实施的技术瓶颈;由于无法进行器件级测试,用户不得不在电装后对正样板进行测试和老炼,这带来了诸多问题,例如:如果老炼试验应力不足,则将无法获得批次质量信息。为了既能够满足工程型号需求,又能符合标准规范地开展宇航用元器件的测试和老炼试验,提出了一种板方式器件级测试的实施技术途径,并对成本进行了分析,通过实践检验证明,该方法具有可实施性。

With the rapid development of low-cost satellites, the selection demand for commercial devices is becoming more and more exuberant. For the quality assurance working of some complex commercial devices, testing has become a technical bottleneck for engineering implementation. Because it is unable to perform device-level testing, users have to carry out testing and burn-in for the positive template after the electric installation, which brings many problems such as if the stress of the burn-in test is insufficient, the batch quality information will not be obtained. In order to solve the engineering model requirements, and to carry out the testing and burn-in test of aerospace components in accordance with the standard specifications, a technical implementation approach of board mode device-level test is put forward, and the cost is analyzed. Besides, the practice test shows that the method is implementable.