倒装焊塑封翘曲失效分析

The Warpage Failure Analysis of Flip-Chip Plastic Package

随着集成电路引出端数量的急剧提升,倒装焊型塑料封装能够满足集成电路I/O数量增加、封装的体积/重量减小和高频性能提高等发展需求。然而受封装材料间的热膨胀系数不匹配、封装结构等因素的影响,倒装焊塑封电路可能出现翘曲、分层等问题,从而严重地影响电路的可靠性。对影响倒装焊塑封电路翘曲的关键因素(材料特性、厚度等)进行了研究,针对某款FC-PBGA668电路,采用ANSYS仿真分析软件,对电路参数进行了仿真优化,并进行了实验验证,结果表明,采用仿真与实验相结合的方式,可以有效地控制和优化封装翘曲度,对于保障倒装焊塑封电路的可靠性具有重要的意义。

With the sharp increase in the number of integrated circuit terminals, filp chip plastic packages can meet development needs such as the increase in the number of integrated circuit I/O, the reduction in package size/weight, and the improvement in high frequency performance. However, due to factors such as CTE mismatching between packaging materials and packaging structure, the FC plastic circuit may have warpage, delamiration and other problems,which seriously affects the reliability of the circuit. The key factors( including material characteristics, thickness, etc.) affecting the warpage of FC plastic circuit are studied,and for a FC-PBGA668 circuit, its parameters are simulated and optimized by using ANSYS simulation analysis software, and the experimental verification is carried out. The results show that the package warpage can be effectively controlled and optimized by the combination of simulation and experiment, which is of great significance to ensure the reliability of the FC plastic circuit.