摘要
本文采用 Sn 基活性钎料首次在金属-陶瓷润湿系统中发现了润湿前驱膜现象。仔细研究表明,这种前驱膜的形成与活性钎料中活性元素种类、陶瓷材料、第三组元种类及润湿温度有关。扫描电镜观察发现,前驱膜由一层连续的活性元素构成的反应膜和这层表面膜上停驻的细小而分离的 Sn 岛所组成。
The wetting precursor film in liquid metal-ceramic system was first found by Snbased active solders in this paper.The results show that the formation of the film depend on thekinds of the active metal in the solder,ceramics,the third element in the solder and wetting tem-perature.In observation by SEM,the film was composed of a layer of continuous reactive filmwith active metal and many small Sn islands lying on the reactive film.
基金
国家自然科学基金
5860356
关键词
钎焊
金属
陶瓷
连接
焊接
soldering
metal/ceramic joining
brazes
wetting
Sn
