不同表面处理方式对润瓷与树脂水门汀黏结强度的影响研究

Effect of different surface treatment on the bond strength of Hyramic to resin cement

目的研究不同表面处理方式对润瓷与树脂水门汀黏结强度的影响。方法将润瓷切割成12 mm×14 mm×8 mm和12 mm×14 mm×3 mm两种尺寸的试件,每种尺寸的试件随机分成6组,分别进行不同的表面预处理:未处理组(NT组)、硅烷化处理组(Si组)、氢氟酸组(HF组)、氢氟酸联合硅烷化处理组(HF+Si组)、喷砂组(SB组)、喷砂联合硅烷化处理组(SB+Si组)。使用树脂水门汀将各组12 mm×14 mm×8 mm的试件两两黏结,制作微拉伸试件,37℃去离子水中水浴24 h后进行微拉伸强度测试。12 mm×14 mm×3 mm的试件用于测量预处理后的试件表面粗糙度,并扫描电镜观察表面形貌。将微拉伸黏结强度及粗糙度测量结果采用SPSS 22.0软件进行单因素方差分析。结果不同表面处理方式对润瓷的黏结强度和粗糙度均有明显影响(F值分别为7.228、551.032,P <0.05)。HF组和SB组黏结强度和粗糙度均大于NT组,差异有统计学意义(P <0.05),且SB组的粗糙度明显高于HF组(P <0.05),但两者黏结强度差异无统计学意义(P> 0.05)。Si组黏结强度大于NT组(P <0.05),但两组粗糙度比较,差异无统计学意义(P> 0.05)。HF+Si组黏结强度明显低于HF组(P <0.05)。SB+Si组黏结强度和粗糙度与SB组相比,差异无统计学意义(P> 0.05)。结论氢氟酸处理、喷砂处理和硅烷化处理的单独应用均可不同程度地提高润瓷的黏结强度,而氢氟酸处理不适合与硅烷化处理联合应用。

Objective To evaluate the effect of different surface treatment on the bond strength of Hyramic to resin cement. Methods Hyramic was cut into two samples:12 mm × 14 mm × 8 mm and 12 mm × 14 mm × 3 mm. The samples of each size were randomly divided into six groups and managed by different surface treatment:no treatment(group NT),silanization(group Si),hydrofluoric acid etching(group HF),hydrofluoric acid combined with silanization(group HF+Si),sandblasting(group SB),and sandblasting combined with silanization(group SB+Si). The 12 mm × 14 mm × 3 mm samples were used to measure the surface roughness and were observed by scanning electron microscope. Each two of the specimens in the groups of 12 mm × 14 mm × 8 mm were bonded together to make microtensile specimens. The microtensile strength was tested after storage for 24 hours in 37℃ distilled water. The results of microtensile bond strength and surface roughness were statistically analyzed by univariate analysis with SPSS 22.0 software. Results The microtensile bond strength and roughness of Hyramic were significantly affected by different surface treatments(F = 7.228,551.032,P < 0.05). The bond strength and roughness of group HF and group SB were significantly higher than that of group NT(P < 0.05),and the roughness of group SB was significantly higher than that of group HF(P < 0.05),but the bond strength was of no significant difference between the two groups(P > 0.05). The bond strength of group Si was higher than that of group NT(P < 0.05),but the difference in roughness between these two groups was not statistically significant(P > 0.05). The bond strength of group HF+Si was significantly lower than that of group HF(P < 0.05). Difference in bond strength and roughness between group SB and group SB+Si was of no statistical significance(P > 0.05). Conclusion Hydrofluoric acid etching,sandblasting and silanization can improve the bond strength of Hyramic to different degrees. Hydrofluoric acid etching is not suitable for combined application with silanization.