光学材料的磨削损伤控制试验研究

Experimental study on grinding damage control of optical materials

基于K9玻璃不同的磨削工艺参数确定其磨削损伤层深度随工艺参数变化的规律,并通过工件磨削损伤层深度的动态检测研究其裂纹扩展规律。结果表明:工件磨削过程中的裂纹损伤是动态扩展过程。固定工艺参数下,裂纹稳态扩展,损伤层深度不变;采用损伤更小的工艺参数磨削,裂纹的扩展速度小于材料的去除速度,其损伤层深度逐渐减小,损伤的去除速度逐渐减慢直至二者间达到稳态平衡。同时,为了去除前道工序的损伤层,后道工序的材料去除量需达到前道工序损伤层深度的2~3倍。

Based on the different grinding process parameters of K9 glass,the law of the change of the depth of grinding damage layer with the process parameters is determined,and the crack propagation law is studied through the dynamic detection of the depth of grinding damage layer of the workpiece.The results show that the crack damage in grinding process is a dynamic propagation process.Under the fixed process parameters,the crack propagates steadily so that the depth of the damaged layer remains constant.When the grinding process parameters with less damage are used,the crack growth speed is less than the material removal speed,and hence the depth of damage layer is gradually reduced.The removal speed of damage layer is gradually slowed down until a balance between the growth speed and the removal speed.At the same time,in order to remove the damage layer of one process,the material removal amount of the next process should be 2 to 3 times of the damage layer depth of the previous process.