基于三维封装模型的高压芯片封装散热方法研究

Research on Heat dissipation method of High Voltage Chip Packaging based on 3D Packaging Model

为了量化分析高压芯片封装散热的散热性能,提出基于三维封装模型的高压芯片封装散热方法。利用传热方程和能量方程分析高压芯片封装散热的平衡关系,建立高压芯片封装散热的循环迭代面模型,求解三维封装高压芯片封装散热的流动热力学特征量,采用定量递归分析方法分析三维封装的面积、流程等参量信息,在给定的温度、压力条件下,使得高压芯片封装散热流动的最优参数理论值与实测值达到最佳拟合,采用三维封装模型实现高压芯片封装散热的力学参数求解,提高高压芯片封装散热性能。研究表明,采用该方法进行高压芯片封装散热分析,提高芯片的散热性能,分析结果可靠,提高流动的换热面积与进出口差值,从而提高了散热效果。

In order to quantitatively analyze the heat dissipation performance of high voltage chip packaging,a high voltage chip packaging heat dissipation method based on three dimensional packaging model is proposed.The heat transfer equation and energy equation are used to analyze the equilibrium relationship of heat dissipation in high voltage chip packaging,the cyclic iterative surface model of high voltage chip packaging heat dissipation is established,the flow thermodynamic characteristics of heat dissipation in three dimensional packaging high voltage chip package are solved,and the area,flow and other parameter information of three dimensional packaging are analyzed by quanti ative recurrent analysis method under given temperature and pressure conditions.The theoretical value of the optimal parameters of the heat dissipation flow of the high voltage chip package is best fitted with the measured value.The three dimensional packaging model is used to solve the mechanical parameters of the heat dissipation of the high voltage chip package,and the heat dissipation performance of the high voltage chip package is improved.The results show that the heat dissipation analysis of high voltage chip package is carried out by using this method,the heat dissipation performance of the chip is improved,the analysis results are reliable,and the difference between the heat transfer area and the inlet and export of the flow is increased,thus the heat dissipation effect is improved.