摘要
本文针对CCGA的焊盘设计、贴装设计、回流焊接曲线设计进行了优化。通过装联后的焊点经过X-RAY、金相分析等检测手段,CCGA焊点质量符合要求。通过加固设计,使得CCGA焊点满足可靠性要求。
With the application of CCGA devices more and more widely,there are some problems in the process of assembly and application,such as solder joint defects,reliability and so on.In this paper,the welding pad design,mount design and reflow welding curve design of CCGA are optimized.By mean of X-ray and metallographic analysis,CCGA welding spot quality meets the requierments,Through the reinforcement design,CCGA solder joint can meet the reliability requierments.
作者
李龙
王东
何燕春
刘丙金
郭孟飞
Li Long;Wang Dong;He Yanchun;Liu Bingjin;Guo Mengfei(Xi'an Aeronautics Computing Technique Research Institute,AVIC,Xi'an Shaanxi,710077)
出处
《电子测试》
2020年第9期66-67,100,共3页
Electronic Test
