用于LED封装的等离子清洗设备选型及工艺优化

Selection and process optimization of plasma cleaning equipment for LED packaging

等离子清洗工艺具有效果明显、操作简单的优点,在电子封装(包括半导体封装、LED封装等)中得到了广泛的应用;基于加工成本考虑,LED封装制程中普遍采用高密度加工方式(整个料盒清洗),清洗效果不理想。本文针对用于LED封装的等离子清洗设备选型、工艺优化进行了探讨,提出了有效的解决方案。

Plasma cleaning has the advantages of obvious effect and simple operation,and has been widely used in electronic package (including semiconductor package,LED package,etc.).Based on the processing cost,In the LED packaging,the high-density processing method (the whole cassette cleaning) is widely used,and the effect of plasma cleaning is not ideal.This paper discusses the selection of plasma cleaning equipment and the optimization of cleaning process for LED packaging,and puts forward an effective solution.