WCu10合金与60Si2Mn扩散连接界面结构及性能研究

Micro-Structure and Mechanical Properties of Diffusion Bonding Joints Between WCu10 and 60Si2Mn Using Cu Inter-Layer

通过添加Cu中间层,在1050℃/10 MPa/1 h的工艺条件下,对钨铜合金/钢进行了真空扩散连接,对扩散连接接头的界面形貌、元素分布、显微硬度和抗拉强度进行了研究。结果表明:采用Cu中间层能够实现钨铜合金与钢的有效连接,各接头界面完好,结合紧密,无不连续或开裂等缺陷;接头的平均抗拉强度为307.1 MPa,焊接界面实现了冶金结合;通过断口形貌及EDS扫描发现接头断裂位置发生在WCu10/Cu界面,断裂方式属于脆性断裂。

The diffusion bonding characteristic between WCu10 composite and steel interface was investigated in vacuum diffusion bonding furnace at 1050℃for 1h with 10 MPa,using Cu foil as inter-layer.The micro-structure,phase compositions,micro-hardness and tensile strength of joints were observed and measured.The results showed that the interface was reliable bonded by using an inter-layer,and the joint is intact and tightly combined without any continuous or cracking defects.The average tensile strength of the joints is 307.1 MPa.Metallurgical bonding was realized in the bonding interface.According to the morphology of the joint and EDS scanning,it was found that the tensile fracture occurred at the WCu10/Cu interface,and the fracture mode was brittle fracture.