一种用于电感加固的改进点胶方案

An Improved Dispensing Solution for Inductor Reinforcement

电子产品在较为严苛的环境工作时,比如高低温工作、功能振动、耐久振动、温度冲击等对产品自身器件的稳固性有很高的要求。目前,三防操作人员会在体积大、个头高的器件周围点胶,可达到加固的效果。而一旦点胶所用的材料选择错误,便会出现器件脱落、断裂等现象。文章介绍了一种针对特殊结构器件的特殊点胶工艺的改进方案,希望为提高器件的稳定性提供一些思路。

When electronic products work in a more severe environment, such as high and low temperature work, functional vibration, durable vibration, temperature shock and so on, they have high requirements for the stability of their own devices. At present, the operators of three proofs will apply glue around the devices with large volume and high height, which can achieve the effect of reinforcement. Once the material used for dispensing is selected incorrectly, the device will fall off and break. This paper introduces an improved scheme of special dispensing process for special structure devices, hoping to provide some ideas for improving the stability of devices.