基于有限元法的胶接接头胶层应力分析

Analysis of the Stress of the Adhesive Layer of the Glue Joint Based on the Finite Element Method

胶层应力对胶接接头的强度有着至关重要的影响。文章尝试使用有限元法对一种典型的胶接接头进行应力分析,获得胶层的剥离应力和剪应力,其应力分布符合弹性力学的结论,对胶层的损伤机理研究具有指导意义。文章还对斜削接头进行了胶层应力分析,结果表明该有限元模型适用广泛,具有良好的工程应用价值。

The stress of the adhesive layer has a vital effect on the strength of the adhesive joint. In this paper, the stress analysis of a typical glue joint is used by the finite element method, and the peeling stress and shear stress of the glue layer are obtained, and the stress distribution conforms to the conclusion of elastic mechanics, which is of guiding significance to the study of the damage mechanism of the adhesive layer.The paper also analyzes the adhesive layer stress of the beveled joint. The results show that the finite element model is widely applicable and has good engineering application value.