基于时频域混合分析的太阳能硅片缺陷检测方法

Defect Detection Method of Solar Silicon Wafers Based on Time-frequency Domain Hybrid Analysis

针对太阳能硅片的水印缺陷,提出一种基于时频域混合分析的检测方法。在此基础上,设计太阳能硅片表面缺陷检测硬件系统。对采集的硅片图像,首先在时域进行图像预处理,然后利用实数快速傅里叶变换得到频率谱图像;在频域里,设计高斯滤波器滤波,再通过傅里叶逆变换获得重构图像,转换到时域,进行差分得到差分图像;最后通过阈值化和形态学操作获得缺陷区域。实验结果表明:此方法对包含水印缺陷的太阳能硅片样本进行缺陷检测的准确率高,具有较高的实用价值。

Aiming at watermark defects of solar silicon wafers,a detection method based on time-frequency domain hybrid analysis was proposed.On this basis,the hardware system of the solar silicon wafers surface defect detection was designed.First image preprocessing was executed in time domain for collected silicon images,then frequency spectrum images were obtained by real fast Fourier transform,and the optimal Gaussian filter was designed for filtering,and then reconstructed images were obtained through the real fast inverse discrete Fourier transform,and the difference images were obtained by difference method in time domain.Finally,the defect areas were acquired by threshold and morphological operation.Experimental results show that this method has high accuracy on defect detection for solar silicon wafers samples including watermark defects and it has high practical value.