SPS制备铜/镀铜石墨复合材料的组织和性能

Microstructure and Properties of Cu/Cu-coated Graphite Composites Prepared by SPS

采用放电等离子烧结(SPS)制备不同镀铜石墨含量的铜/镀铜石墨复合材料。研究了镀铜石墨含量对复合材料微观组织、密度、导电率、孔隙率和显微硬度的影响。结果表明,随着镀铜石墨含量的增加,铜基体的组织变得细小、均匀。复合材料的密度与镀铜石墨含量满足公式ρ=-0.1506wt%+8.894。当镀铜石墨含量由0wt%增大12wt%,复合材料的导电率由96.4%IACS降低至58.0%IACS,孔隙率从0.1%升高至8.8%。少量的镀铜石墨具有细晶强化作用,能提高复合材料的硬度。当镀铜石墨含量超过4 wt%,复合材料的硬度开始下降,当镀铜石墨含量达到一定值时,复合材料的硬度甚至低于纯铜材料的硬度。

Cu/Cu-coated graphite composites with different Cu-coated graphite contents were prepared by spark plasma sintering(SPS).The effects of Cu-coated graphite content on the microstructure,density,conductivity,porosity and microhardness of the composites were studied.The results show that with the increase of the content of the Cu-coated graphite,the microstructure of the copper matrix becomes fine and uniform.The formula of density and Cu-coated graphite content isρ=-0.1506wt%+8.894.When the content of Cu-coated graphite increases from 0wt% to 12wt%,the conductivity of the composites decreases from 96.4% IACS to 58.0% IACS,the porosity increases from 0.1%to 8.8%.A small amount of Cu-coated graphite has a fine-crystal strengthening effect,and the hardness of the composite material can be improved.When the content of Cu-coated graphite is more than 4wt%,the hardness of the composite begins to decrease.When the content of Cu-coated graphite reaches a certain value,the hardness of the composite is even lower than that of pure copper.