废PCB粉/PP复合材料的非等温热分解动力学

Non-Isothermal Decomposition Kinetics of Waste Printed Circuit Boards Nonmetallic Powder/Polypropylene Composite

利用热重分析法(TGA)研究了聚丙烯(PP)、废印刷电路板非金属粉/聚丙烯(废PCB粉/PP)复合材料的热分解过程,分别采用Kissinger法和Flynn-Wall-Ozawa法研究了PP及其复合材料的热分解动力学。结果表明,废PCB粉的加入可明显提高复合材料的热稳定性。当废PCB粉用量升高到50%时,最大热分解速率温度(472.7℃)与纯PP(451.4℃)相比提高了21.3℃。废PCB粉中的玻璃纤维与PP分子链相互缠结,限制了聚合物分子的运动,使废PCB粉/PP复合材料的活化能与聚丙烯相比明显增大,复合材料分解需要更高的温度,且随废PCB粉用量的增加,复合材料的活化能不断增加,当废PCB粉用量为50%时,复合材料活化能与聚丙烯相比约提高了44.8%。

Thermal decomposition process of polypropylene and waste printed circuit boards nonmetallic powder/polypropylene composite were investigated by dynamic thermogravimetric analysis(TGA).Kissinger and Flynn-Wall-Ozawa equations were used to calculate the thermal degradation activation energies.The results demonstrated that waste PCB powder had the effect of thermal decomposition process,increased the thermal stability of composite.The maximum thermal decomposition rate temperature improve 21.3℃,when the dosage of waste PCB powder was 50%.The glass fiber of waste PCB powder and polypropylene molecular chain entangled with each other,which had limited molecular motion of polymer.The thermal degradation activation energies of composite were higher than that of pure polypropylene,and activation energies increased gradually with the increasing of waste PCB powder.When the contents of waste PCB was 50%,the thermal degradation activation energies of composite was 44.8%higher than that of pure polypropylene.