LED封装用UV光固化硅树脂的制备及性能研究

Preparation and Properties of UV-curable Silicone Resin for LED Package

通过水解-缩聚制备了不同分子结构的巯基硅树脂(MDT-SH),并将MDT-SH与乙烯基硅树脂和光引发剂配合,制备了紫外(UV)光固化硅树脂;然后对UV光固化树脂的光固化动力学进行了研究,对光固化制品的热稳定性、透光性和封装性能进行了详细分析。结果表明,当有机基团与硅的比值(R/Si)为1.88,巯基含量为0.34 mol/100 g时,MDT-SH硅树脂的相对分子质量分布较均匀且产率较高;当光引发剂2,4,6-三甲基苯甲酰基膦酸乙酯(TPO-L)的含量为1.0%、辐照强度为80 mW/cm^2、巯基与乙烯基摩尔比(SH/Vi)为1.5/1时,树脂可较快速交联成型;UV光固化树脂不仅具有优异的透光率和耐热性,且其封装发光二极管(LED)器件的性能明显优于市售道康宁封装胶OE-6550;有望替代传统热固型LED封装胶,实现规模化使用。

A type of thiol-functionalized MDT silicone resin(MDT-SH)with different molecular structures was synthesized by hydrolysis-polycondensation,and then the MDT-SH was mixed with vinyl-functionalized silicone resin and photo-initiator to prepare a UV-curable silicone resin.The UV-curing kinetics of this UV-curable silicone resin was studied,and its thermal stability,transmittance and package performance were analyzed in detail.The results indicated that the MDT-SH exhibited a more uniform molecular weight distribution and a higher yield when synthesized at the R/Si molar ratio of 1.88/1 and the thiol content of 0.34 mol/100 g.The UV-curable silicone resin with a TPO-L dosage of 1.0%and an SH/Vi molar ratio of 1.5/1 could be instantly cured when exposed to UV irradiation at 80 mW/cm^2.The UVcured resin exhibited an excellent thermal stability and transmittance.The LED packaged by this UV-cured silicone resin also showed much better performance than those packaged by the Dow Corning OE-6550 commercial counterpart.The UV-curable silicone resin developed by this work shows a great potential in LED package in future.