摘要
综述了用于248 nm化学增幅型深紫外光刻胶的不同种类和结构的成膜树脂,以及所使用单体的研发进展,包括聚甲基丙烯酸甲酯及其衍生物、聚对羟基苯乙烯及其衍生物、N取代的马来酰亚胺衍生物,以及其他聚合物等,对不同结构成膜树脂的曝光条件、对光刻胶性能的影响进行了介绍。
Different kinds of matrix resins and structures used in 248 nm chemically amplified deep UV photoresist were summarized,including poly(methyl methacrylate)and its derivatives,poly(p-hydroxystyrene)and its derivatives,N-substituted maleimide derivatives and other polymers,and the influences of the structure and exposure conditions of film-forming resins or monomers on photoresist properties were discussed.
作者
魏孜博
马文超
邱迎昕
WEI Zibo;MA Wenchao;QIU Yingxin(Yanshan Branch,Sinopec BRICI,Beijing 102500,P.R.China;Rubber and Plastic Synthesis National Engineering Research Center,Beijing 102500,P.R.China)
出处
《影像科学与光化学》
CAS
2020年第3期430-435,共6页
Imaging Science and Photochemistry
基金
中石化总部项目(G3365-2019-Z1912)。
关键词
光刻胶
成膜树脂
化学增幅型
曝光
photoresist
matrix resin
chemical amplification
exposure
