摘要
本文探讨了阻焊掉油的影响因子,通过阻焊的流程分析锁定改善的范围,分析确定主要影响因子,利用主要的影响因子设计DOE试验,确定最佳的生产参数,从而稳定生产制程,保证生产品质。
This paper studies the influence factors of solder-resist off.The range of improvement is analyzed by the process of solder mask.The main influence factors are determined through relevant test analysis.DOE test is designed by using the main influence factors.The best production parameters,so as to stabilize the production process,ensure the production quality,and make the products meet the customer requirements.
作者
邓松林
林映生
陈春
胡光辉
李光平
余卫宇
Deng Songlin;Lin Yingsheng;Chen Chun;Hu Guanghui;Li Guangping;Yu Weiyu
出处
《印制电路信息》
2020年第4期27-30,共4页
Printed Circuit Information
关键词
前处理
塞孔
阻焊剂
固化
Pre-Treatment
Plug Hole
Solder Resist
Curing