摘要
随着PCB上的孔越来越密,技术难度越来越大,成孔技术越来越重要。针对此,从物料(原理)、工艺和质量三方面详细研究了目前应用最为广泛的三种PCB微孔加工技术(机械钻孔、CO2激光成孔、UV激光成孔)的特点、现状。
PCB micro-via processing technology is more important than before with the denser quantity and the more difficult technology of micro-via.Aiming at this situation,the paper studies characterization,current status,and development trends of PCB micro-via processing technology,including mechanical drilling,CO2&UV laser processing based on its material(or,principle),processing and quality,which are the most extensive application technology in themicro-via processing technology.
作者
杨宏强
Yang Hongqiang(Shanghai Unifree Electronic Technology Co.,Ltd.,Shanghai 201302,China)
出处
《印制电路信息》
2020年第4期31-38,共8页
Printed Circuit Information
关键词
微孔
机械钻孔
CO2激光成孔
UV激光成孔
Micro-via
Mechanical Drilling
CO2 Laser Processing
UV Laser Processing
