PCB板镀铜生产线镀槽、传动装置及控制电路设计

Design of Electroplating Trough,Transmission Device and Control Circuit for PCB Plate Copper Electroplating Production Line

PCB板是电子元器件电气连接的载体。PCB板镀铜是在其孔壁上镀一层铜薄膜。目前在工业中广泛采用连续镀铜,在镀铜生产线上完成大部分工序。PCB板镀铜生产线由多个部分组成,在满足工艺要求的前提下,为了尽可能降低成本并提高效率,各部分的设计都非常关键。以某条PCB板镀铜生产线为例,主要介绍了镀槽、传动装置、气动系统和控制电路的设计。

PCB board was the carrier for electrical connection of electronic components,and PCB plate copper electroplating was electroplating of a thin copper film on the hole wall.Continuous copper electroplating was currently widely used in industry and most processes were completed in the copper electroplating production line.PCB copper electroplating production line was composed of several parts.Under the premise of meeting the process requirements,in order to reduce the cost and improve the efficiency asmuch as possible,the design of each parts was very critical.Taking a PCB plate copper electroplating production line as an example,the design of electroplating trough,transmission device,air-operated system and control circuit was introduced.