感应软熔工艺参数对K板ATC的影响研究

Study on Influence of Induction Reflowing Process on ATC of K-tinplate

ATC是评价K板耐蚀性的一项重要指标,本文研究了感应软熔工艺中软熔温度、软熔高度和淬水温度对K板锡铁合金层及ATC的影响。结果表明:适当提高软熔温度和软熔高度,使K板在进入水淬槽之前铁原子充分扩散,有利于提高合金层的厚度和连续性从而降低ATC。淬水温度通过影响合金锡形貌而影响合金层的致密性。在实际生产中带速通常为150 m/min,当软熔温度为300℃,软熔高度为6.5 m,淬水温度为80℃时,ATC达到最小值0.060μA/cm^2。

ATC is an important evaluation indicator of K-tinplate corrosion resistance,so the effects of reflowing temperature,reflowing height and quenching temperature on the Sn-Fe alloy layer and ATC of K-plate were studied.The results showed that the reflowing temperature and reflowing height could be increased appropriately,so that the iron atoms could be fully diffused before the K plate entered the water quenching tank,which was beneficial to increase the thickness and continuity of the alloy layer and thus reduce the ATC.The quenching temperature affected the compactness of the alloy layer by affecting the morphology of the alloy.In practical production,the strip speed was usually 150 m/min,when the reflowing temperature was 300℃,the reflowing height was 6.5 m,and the quenching tempera⁃ture was 80℃,the ATC reached the minimum value of 0.060μA/cm^2.