一种新型的超宽带板间垂直互连电路

A novel ultra⁃wideband vertical interconnection circuit between substrates

随着集成电路密度的提高,板间互连结构成为不可忽视的一项重要技术。设计了一种基于HTCC工艺的新型超宽带板间互连电路,利用微波传输技术以及电磁仿真软件分析了信号的传输性能,表现了该结构的可行性。与BGA结构和毛纽扣结构进行仿真对比,表明其性能优于毛纽扣,且与BGA相当。优化后的互连电路在DC-30 GHz内信号的插入损耗小于0.35 dB,回波损耗优于15 dB,具有良好的传输性能。应用该互连电路的接收前端模块体积缩小40%。

With the increasing of the density of integrated circuits,the interconnection structure between substrates becomes an important technology that cannot be ignored.In this paper,a novel ultra⁃wideband interconnection circuit between substrates based on HTCC technology is designed,the transmission performance of the signal is analyzed by using microwave transmission technology and electromagnetic simulation software,and the feasibility of the structure is demonstrated.Compared with the BGA structure and the Fuzz button structure,the results show that its performance is better than the Fuzz button and similar to the BGA.The optimized interconnection circuit has better transmission performance with the insertion loss less than 0.35 dB,and the return loss is better than 15dB in DC-30 GHz.The volume of the receiving front⁃end module of the interconnection circuit is reduced by 40%.