PEEK基底上厚度为6.4 nm的金薄膜导热导电性能研究

Investigation on Thermal and Electrical Conductivity of 6.4 nm Gold Films Deposited on PEEK Substrate

运用高真空溅射镀膜仪在聚醚醚酮(PEEK)薄膜和纤维表面分别制备了厚度为6.4 nm的金薄膜,并通过瞬态电热技术(TET)测量了该金薄膜的导热性和导电性。PEEK薄膜基底上厚度为6.4 nm的金薄膜的导热系数、导电系数和洛伦兹数分别为283.97 W·m^-1·K^-1、2.46×10^7Ω^-1·m^-1和3.49×10^-8W·Ω·K^-2。PEEK纤维基底上厚度为6.4 nm的金薄膜的导热系数、导电系数和洛伦兹数分别为81.11 W·m^-1·K^-1、1.20×10^7Ω^-1·m^-1和2.17×10^-8W·Ω·K^-2。研究发现,在不同基底材料上制备的金薄膜的导热系数、导电系数和洛伦兹数均不同。这种差异可以归因于以下两点:一方面,不同基底材料上制备的金薄膜的晶粒尺寸不同;另一方面,不同的基底材料会引起基底与金薄膜结合界面的平整度不同。金薄膜晶粒尺寸越小,其电子的导热系数、导电系数越小;金薄膜与基底的结合界面平整度越差,其声子的导热系数越小。

The gold films(the average thickness is 6.4 nm)coated on the surface of poly(ether-ether-ketone)(PEEK)film and PEEK fiber by the magnetron sputtering system were prepared.Transient electrothermal technique(TET)was used to acquire thermal and electrical conductivitiy of the gold films.The thermal conductivity,electrical conductivity and the Lorenz number of the gold film coated on PEEK film is 283.97 W·m^-1·K^-1,2.46×10^7Ω^-1·m^-1 and 3.49×10^-8 W·Ω·K^-2,respectively.The thermal conductivity,electrical conductivity and the Lorenz number of the gold film coated on PEEK fiber is 81.11 W·m^-1·K^-1,1.20×10^7Ω^-1·m^-1 and 2.17×10^-8 W·Ω·K^-2,respectively.It can be seen that the thermal conductivity,electrical conductivity and Lorenz number of the gold films coated on the different substrate materials are different.The difference is attributed to the facts that the different substrate materials can affect the grain size of the gold film and the flatness of the interface between the substrate and the gold film.The smaller the grain size is,the smaller the electron conductivity and thermal conductivity is.The worse the interface roughness is,the smaller the phonon thermal conductivity is.