MEMS陀螺在片自动测试系统开发

Development of Automatic Test System for MEMS Gyroscope on Wafer Test System

为了快速评估出微机械陀螺的振动性能参数,结合ASIC探针卡,NI数据采集卡,半自动探针台和软件实现了圆片级自动测试,判断出陀螺是否能正常振荡。实验结果表明,该圆片级在片自动测试系统能准确的测量出芯片的振动性能,快速准确的反映出工艺能力,且实现圆片级挑选出不同等级性能的陀螺芯片,对陀螺的设计和生产加工具有重要的促进作用。

In order to evaluate the vibration performance parameters of MEMS gyroscope quickly,combining ASIC electrocircuit probe card,Ni data acquisition card,the probe station platform and and software,the automatic test system on wafer level is realized to determine whether the gyroscope can oscillate normally.The experimental results show that the wafer-level on-chip antomatic test system can accurately measure the vibration performance of the chip,quickly and accurately reflect the process capability,and realize the selection of gyro chips with different levels of performance at the wafer level,which plays an important role in the design and production of gyroscope.