摘要
高频高阶HDI板是当今PCB领域的研究热点之一。文章以一款整体10层,包含高频、高阶叠孔、非对称结构压合、精密线路、高纵横比电镀等设计的高频高速高阶HDI板为例,概述了这类印制板制作过程中的常见制作难点,并就这些制作难点提出了一些新的改善思路和方法。
High-frequency and high-step HDI board has become one of the hot research topics in PCB field at present.Taking a 10-layer HDI board,including high frequency,high-step stack holes,asymmetric structural lamination,precise lines,high-aspect ratio electroplating,etc.,as an example,this paper summarized the main technical difficulties in fabricating of this kind of PCBs and then put forward some new thoughts and ways for improvement on these technical difficulties.
作者
戴勇
寻瑞平
刘红刚
敖四超
Dai Yong;Xum Ruiping;Liu Honggang;Ao Sichao
出处
《印制电路信息》
2020年第5期20-25,共6页
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