摘要
针对多层微波板的盲槽底部含有金属图形和局部金属化孔的特殊结构,文章提出了一种新型的制作方法:采用机械控深背钻技术实现局部金属化孔的制作,采用机械控深开盲面技术和CO2激光控深除介质技术实现盲槽底部金属图形的制作,生产过程可控,产品质量可靠。
The special structure of multilayer microwave board has metal figure and local metalized hole at the bottom of blind groove.This paper presents a new manufacturing method by using mechanical deep back drilling technology to make local metalized hole of the blind groove,and by using mechanical deep slotting technology and carbon dioxide laser deep removing medium technology to make metal figure of the blind groove.The production process is controllable and the product quality is reliable.
作者
牛顺义
朱忠翰
沈岳峰
许文涛
Niu Shunyi;Zhu Zhonghan;Shen Yuefeng;Xu Wentao(Anhui Sun-Create Electronics Corporation Limited,Hefei 230031,China)
出处
《印制电路信息》
2020年第5期30-32,共3页
Printed Circuit Information
关键词
多层微波板
盲槽底部局部金属化孔
背钻
机械控深开盲面
Multilayer Microwave Bboard
Local Metalized Hole of Blind Groove
Back Drilling
Mechanical Deep Slotting Technology