期刊文献+

高压SOI pLDMOS器件电离辐射总剂量效应研究 被引量:2

Study on Total Dose Effect of Ionizing Radiation of High-Voltage SOI pLDMOS Devices
下载PDF
导出
摘要 研究了总剂量辐射致使高压SOI pLDMOS器件电学性能的退化,报道了在300 krad(Si)辐射下,高压SOI pLDMOS器件耐压的退化以及阈值电压的负向漂移。通过仿真软件对器件的基础电学特性进行了仿真优化,并且对器件电学性能的退化进行了仿真探究,分析器件性能退化的原因。 This paper researches the degradation of the electrical performance of high-voltage SOI pLDMOS device caused by total dose radiation,furthermore,this paper reports the decrease of breakdown voltage and the negative drift of the threshold voltage of the high-voltage SOI pLDMOS device under 300 krad(Si)total dose radiation.By using simulation software to simulate and optimize the basic electrical characteristics of the device,moreover,the degradation of the electrical performance of the device was simulated and the reasons for the degradation of the device were investigated.
作者 马阔 乔明 周锌 王卓 MA Kuo;QIAO Ming;ZHOU Xin;WANG Zhuo(State Key Laboratory of Electronic Thin Films and Integrated Device,UESTC,Chengdu 610054,China)
出处 《电子与封装》 2020年第6期58-62,共5页 Electronics & Packaging
基金 四川省科技计划资助项目(2019YFG0093)。
关键词 总剂量辐射 SOI LDMOS 击穿电压 阈值电压 TID SOI LDMOS breakdown voltage threshold voltage
  • 相关文献

参考文献4

二级参考文献29

  • 1张恩霞,孙佳胤,易万兵,陈静,金波,陈猛,张正选,张国强,王曦.注氮剂量对SIMON材料性能影响的研究[J].功能材料与器件学报,2004,10(4):437-440. 被引量:1
  • 2吴峻峰,钟兴华,李多力,毕津顺,海潮和.采用半背沟注入提高部分耗尽SOI nMOSFETs的漏源击穿电压(英文)[J].Journal of Semiconductors,2005,26(10):1875-1880. 被引量:1
  • 3Schwank J R,Ferlet-Cavrois V,Shaneyfeh M R,et a1.Radiation effects in SOI technologies[J].IEEE Transactions on Nuclear Science,2003,50(3):522-538.
  • 4郭红霞,陈雨生,周辉.SOI器件电离辐射效应研究[C].第五届全国SOI技术研讨会,上海.2002.
  • 5Paillet P,Autran J L,Flament O,et al.X-radiation response of SIMOX buried oxides:influence of the fabrication process[J].IEEE Transactions on Nuclear Science,1996,43(2):821-825.
  • 6Schwank J R,Fleetwood D M,Xiong H D,et al.Generation of metastable electron traps in the near interfacial region of SOI buried oxides by ion implantation and their effect on device properties[J].Micro-electronic Engineering,2004,72(14):362-366.
  • 7Lee S C,Raparla A,Li Y F,et al.Total dose effects in composite nit ride-oxide films[J].IEEE Trans Nucl Sci,2000,47(6):2297.
  • 8Nicklaw C J,Pagey M P,Pantelides S T,et al.Defects and nanocrystals generated by Si implantation into a-Si O2[J].IEEE Transactions on Nuclear Science,2000,47(6):2269-2272.
  • 9Dodd P E,Shaneyfelt M R, Draper B L, et al. Devel- opment of a radiation-hardened lateral power MOSFET for POL applications [J]. Nuclear Science, IEEE Transactions on, 2009, 56(6): 3456-3462.
  • 10Hughes H L,Benedetto J M. Radiation effects and harden- ing of MOS technology: devices and eircuits[J]. Nuclear Science, IEEE Transactions on, 2003, 50(3) : 500-521.

共引文献13

同被引文献10

引证文献2

二级引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部