制绒上料插片机兼容156~220 mm硅片方法研究

Research of Methods on Compatibility of 156~220 mm’s Wafer Applying to the Texturing Loading Machine

硅片尺寸的增大已经成为了光伏行业发展的必然趋势。本文通过分析研究制绒上料插片机中硅片和花篮传输的工作流程,设计合理的结构并优化PLC程序,调节料盒组件、吹气组件、硅片传输组件和矫正组件对156~220mm硅片的兼容性,来实现整台设备对于不同尺寸规格硅片的兼容,从而提高了设备的竞争力。

The increase of wafer size has become an inevitable trend in the development of photovoltaic industry.Through analyzing the transmission of wafer and wafer carrier in the texturing loading machine,reasonable structures have been designed and PLC programs have been optimized.Therefore,it can achieve the compatibility of the whole equipment for different wafer sizes by adjusting the compatibility of wafer stack subassemblies,wafer blowing subassemblies,wafer transmitting subassemblies and wafer rectifying subassemblies to 156-220mm wafers.And also the competitiveness of the texturing loading machine has been improved.