4LILANA B, GORAN S, LARS S. Paperboard packages exposed to static loads finite element modelling and experiments[J]. Package Teehnol Sci, 2001,14: 171- 178.
5WANG Y Y, LU C, LI J, et al. Simulation of drop/impact reliability for electronic devices[J]. Finite Elements in Analysis and Design,2005,41:667-680.