金属胶接胶瘤尺寸控制

Control of adhesive fillet size in metal bonding technology

金属胶接固化过程中,胶膜在高温高压下融化流动,多余胶液受挤压排出,造成零件局部溢胶过多,胶瘤尺寸过大,影响制件的最终装配。通过分析胶液流动固化后体积变化,开展高度和间隙补偿等对溢胶面积及胶瘤尺寸进行控制的工艺研究。研究结果表明:在固化温度及压力一定的情况下,胶接固化溢胶量基本相同;通过模具优化可改变溢胶扩展规律,有效减小装配区胶接溢胶量,实现零件表面溢胶面积及胶瘤尺寸的控制。

In the process of metal bonding and solidification,adhesive film melted and flowed under high temperature and high pressure,and excess adhesive solution was squeezed out.As a result,it caused excessive adhesive overflow in parts and relatively large size of adhesive fillet,which influenced the final assembly of parts.Based on the analysis of volume change of adhesive solution after flowing and solidifying,the research on the control technology of height and gap compensation on the overflow area and adhesive fillet size was carried out.The research results showed that under the condition of certain curing temperature and pressure,the amount of adhesive overflow was basically the same.The expansion rule of adhesive overflow could be changed through mold optimization,which could effectively reduce the amount of adhesive overflow in the assembly area,and achieve the control of adhesive overflow area and adhesive fillet size on the surface of parts.