摘要
介绍了清洗工艺中常用的干燥方式,以及不同干燥方式给晶片带来的水痕缺陷、颗粒超标等污染。应用过程中需根据不同的工艺要求,选择合适的干燥方式,以达到高效、洁净的干燥效果。
Different drying methods in wet process are introduced.These will lead to water mark defects and excessive particle contamination.Suitable drying method should be selected,in the process of application,according to different technological requirements to achieve efficient and clean drying effect.
作者
刘盈楹
LIU Yingying(The 45th Research Institute of CETC,Beijing 100176,China)
出处
《电子工业专用设备》
2020年第3期23-25,60,共4页
Equipment for Electronic Products Manufacturing