微波多基板组件焊接工艺研究

Research on Soldering Process of Microwave Multi-substrate Module

由于微波组件电路工作频率高,接地要求高,对于电路基板与金属外壳之间的“大面积接地”多采用钎焊工艺。多基板产品的焊接钎透率和基板的精确定位一直是工艺过程中的技术难点。研究了焊料选择、基板定位工装的制备、金导带关键区域保护、焊接工艺选择及优化,将焊接有效面积提高到了95%以上,基本达到了无空洞焊接。

The soldering process is mainly adopted in the“large area grounding”between the circuit substrate and metal case due to the high operating frequency and high grounding requirements of the microwave module circuit.The soldering penetration rate and the positioning of the substrates are always the technical diffi culties in the process.The research is demonstrated on the following aspects:the selection of the solder,the preparation of substrate positioning tool,the protection of key areas of gold conduction band as well as the selection and optimization of the soldering process.Through the research,the effective area of soldering has been increased to over 95%,the void-free soldering is basically achieved.