摘要
分析表明,在微组装产品装配中,经常会遇到芯片表面助焊剂清洗问题。介于目前微电子技术朝着小型化的发展趋势,对微波芯片的集成度要求越来越高,芯片表面洁净度对产品的性能和可靠性有着至关重要的影响。助焊剂残留物中包含酸性、卤化物等化学成分,长时间停留在芯片表面会出现腐蚀现象,使其短路失效。探讨用气相清洗机有效去除芯片表面的助焊剂的方法。
In the assembly of micro-assembled products,the problem of cleaning the flux on the chip surface is often encountered.As the microelectronics technology advances with a trend towards miniaturization,the requirements of integration of microwave chips are becoming higher and higher,and the cleanliness of the chip surface has a crucial impact on the performance and reliability of products.Flux residues contain chemical components such as acids and halides,which will induce the corrosion on the surface of the chip for as time passes by,causing short circuit failure.This article will introduce in detail how to effectively remove the flux from the surface of the chip with a gas-phase cleaning machine.
作者
王舜
WANG Shun(Nanjing Electronic Equipment Research Institute,Jiangsu 210007,China)
出处
《集成电路应用》
2020年第6期24-26,共3页
Application of IC
基金
江苏省高科技企业科技创新课题项目。
关键词
集成电路制造
微组装工艺
气相清洗机
双溶液
芯片清洗
IC manufacturing
micro-assembly process
gas phase cleaning machine
double solution
chip cleaning