芯片黏接失效机理分析与工艺改进

Study on Failure Mechanism of Chip Bonding and Technology Improvement

基于导电胶的芯片黏接工艺具有导热率高、固化温度低、操作简单、易返修、稳定性好、环境适应性强的特点,研究芯片黏接工艺失效机理,建立芯片脱落失效理论模型,提出基于多参数控制的工艺实现方法,从而提高芯片黏接的质量。

The chip bonding process based on conductive adhesive has the characteristics of high thermal conductivity,low curing temperature,simple operation,easy repair,good stability and strong environmental adaptability.In this paper,the failure mechanism of chip bonding process is studied,the theoretical model of chip falling off failure is established,and the process implementation method based on multi parameter control is proposed,so as to improve the quality of chip bonding.